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SEOUL--() August 06, 2013 -- Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first three-dimensional (3D) Vertical NAND (V-NAND) flash memory, which breaks through the current scaling limit for existing NAND flash technology. Achieving gains in performance and area ratio, the new 3D V-NAND will be used for a wide range of consumer electronics and enterprise applications, including embedded NAND storage and solid state drives (SSDs).

Samsung’s new V-NAND offers a 128 gigabit (Gb) density in a single chip, utilizing the company’s proprietary vertical cell structure based on 3D Charge Trap Flash (CTF) technology and vertical interconnect process technology to link the 3D cell array. By applying both of these technologies, Samsung’s 3D V-NAND is able to provide over twice the scaling of 20nm-class* planar NAND flash.

“The new 3D V-NAND flash technology is the result of our employees’ years of efforts to push beyond conventional ways of thinking and pursue much more innovative approaches in overcoming limitations in the design of memory semiconductor technology,” said Jeong-Hyuk Choi, senior vice president, flash product & technology, Samsung Electronics. “Following the world’s first mass production of 3D Vertical NAND, we will continue to introduce 3D V-NAND products with improved performance and higher density, which will contribute to further growth of the global memory industry.”

For the past 40 years, conventional flash memory has been based on planar structures that make use of floating gates. As manufacturing process technology has proceeded to the 10nm-class* and beyond, concern for a scaling limit arose, due to the cell-to-cell interference that causes a trade-off in the reliability of NAND flash products. This also led to added development time and costs.

Samsung’s new V-NAND solves such technical challenges by achieving new levels of innovation in circuits, structure and the manufacturing process through which a vertical stacking of planar cell layers for a new 3D structure has been successfully developed. To do this, Samsung revamped its CTF architecture, which was first developed in 2006. In Samsung’s CTF-based NAND flash architecture, an electric charge is temporarily placed in a holding chamber of the non-conductive layer of flash that is composed of silicon nitride (SiN), instead of using a floating gate to prevent interference between neighboring cells.

By making this CTF layer three-dimensional, the reliability and speed of the NAND memory have improved sharply. The new 3D V-NAND shows not only an increase of a minimum of 2X to a maximum 10X higher reliability, but also twice the write performance over conventional 10nm-class floating gate NAND flash memory.

Also, one of the most important technological achievements of the new Samsung V-NAND is that the company’s proprietary vertical interconnect process technology can stack as many as 24 cell layers vertically, using special etching technology that connects the layers electronically by punching holes from the highest layer to the bottom. With the new vertical structure, Samsung can enable higher density NAND flash memory products by increasing the 3D cell layers without having to continue planar scaling, which has become incredibly difficult to achieve.

After nearly 10 years of research on 3D Vertical NAND, Samsung now has more than 300 patent-pending 3D memory technologies worldwide. With the industry’s first completely functional 3D Vertical NAND memory, Samsung has strengthened its competitiveness in the memory industry as well as set the foundation for more advanced products including one terabit (Tb) NAND flash, while setting a faster pace for industry growth.

According to IHS iSuppli, the global NAND flash memory market is expected to reach approximately US $30.8 billion in revenues by the end of 2016, from approximately US $23.6 billion in 2013 with a CAGR of 11 percent, in leading growth of the entire memory industry.

About Samsung Electronics Co., Ltd.

Samsung Electronics Co., Ltd. is a global leader in technology, opening new possibilities for people everywhere. Through relentless innovation and discovery, we are transforming the worlds of televisions, smartphones, personal computers, printers, cameras, home appliances, LTE systems, medical devices, semiconductors and LED solutions. We employ 236,000 people across 79 countries with annual sales exceeding US$187.8 billion. To discover more, please visitKorea Newswire distributes your news across every media channels through the industry’s largest press release distribution network

BARCELONA, SPAIN--( / ) February 24, 2014 -- LitePoint® (), an award-winning provider of wireless test solutions (), today released 우리형TV 리포푼딘 its LitePoint® IQnfc® (), 우리형TV 메트리날주 the first volume production-optimized test system designed 우리형TV 스킨코튼 to measure and verify the physical layer 네네티비 BARCELONA,of Near Field Communication (NFC) enabled devices. LitePoint will be demonstrating its IQnfc () solution at Mobile World Congress in Barcelona, Spain, February 24th ~ 27th 시크릿 종아리스트레칭기구 in booth 5H31 Hall 5.

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NFC is a wireless technology used for very close proximity connections between wireless 시크릿 황광희성형전후 devices. The technology is being added to smartphones to enable “wave and pay” point-of-sale transactions, which could virtually eliminate the 비아그라판매 NFCto carry credit cards and 시크릿 NFCHowever, 우리형TV 포시카인 the very implementation that gives NFC its short-range, secure operation, also makes it highly sensitive to variations in component performance. This makes production testing, based on parametric measurements, critical for the reliable manufacture of NFC-enabled devices.

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LitePoint will be demonstrating its IQnfc () 시크릿 멋진그림 system and other wireless test solutions for both 시크릿 대박웃긴사진 cellular and 시크릿 connectivity devices at Mobile World Congress 우리형TV in Barcelona, Spain February 24th - 27th 소피아캡신딜도추천 LitePointbooth 5H31 우리형TV Hall 5. The IQnfc 우리형TV 냉동치료 () will be available for shipment April 2014.

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LitePoint (), a wholly-owned subsidiary of Teradyne, Inc. () (NYSE:TER), is based in Sunnyvale, California. The 폭시에브 LitePointdesigns, develops and supports advanced wireless test solutions 감정동성인게임장 LitePoint우리형TV 한방병원 developers of wireless devices and consumer electronics, contract manufacturers and 시크릿 미니사전 wireless integrated circuit designers. LitePoint solutions () have enabled optimization and verification of the operation of more than one billion wireless devices worldwide. LitePoint products () are used in development and high-volume manufacturing, providing its customers with improved ROI, time-to-market, manufacturing yields, and product quality. For more, go toKorea Newswire distributes your 시크릿 국어사전 news across every 시크릿 달나라티비TV media channels through the industry’s largest press release distribution network

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